The last few generations were plagued not only by heat output issues, poor pricing, and underwhelming performance in all but gaming, but also suffered irreparable manufacturing defects. The new lineup is essentially more of the same.
I always try to buy the better product, when given a choice, and it’ll take a lot of convincing me to consider this
Intel is the architect, TSMC does the building, and they’re definitely building to plan. Thus, your leaky roof is the fault of the architect who wasn’t really considering the existence of rain when designing the house.
The last few generations were plagued not only by heat output issues, poor pricing, and underwhelming performance in all but gaming, but also suffered irreparable manufacturing defects. The new lineup is essentially more of the same.
I always try to buy the better product, when given a choice, and it’ll take a lot of convincing me to consider this
This chip is manufactured by TSMC, so that’d be on them.
Intel is the architect, TSMC does the building, and they’re definitely building to plan. Thus, your leaky roof is the fault of the architect who wasn’t really considering the existence of rain when designing the house.
You don’t buy from TSMC, but from Intel. Also, AMD also uses TSMC, they didn’t have such problems recently.
Intel QA failing to audit third party suppliers properly is Intel’s fault.