If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.
But if you’re talking about 10th Gen chips that took forever to get out of the gate due to issues with sub 14nm lithography, then no it’s a hardware issue. Intel has had issues over recent years with actual die shrinks.
Regardless, it feels like what we see with Boeing. A company culture that prioritized marketing and time to market over everything else consequences be damned.
Move fast and break stuff is probably not the best strategy if you are building airplanes or processors or other PhD level stuff… Or maybe it’s just never a good strategy.
Yeah nice fast and break things is a great way to maximize short term profits at the expense of the long term. But fuck it, I got mine in the short term, so it works.
If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.
Yes, I was, but there was also some initial manufacturing issue with oxidation. That wasn’t the bulk of the issues that they were running into, though.
If you’re referring to the 13&14th Gen chips then yes, Intel is saying it’s on the software side.
But if you’re talking about 10th Gen chips that took forever to get out of the gate due to issues with sub 14nm lithography, then no it’s a hardware issue. Intel has had issues over recent years with actual die shrinks.
Regardless, it feels like what we see with Boeing. A company culture that prioritized marketing and time to market over everything else consequences be damned.
Move fast and break stuff is probably not the best strategy if you are building airplanes or processors or other PhD level stuff… Or maybe it’s just never a good strategy.
Yeah nice fast and break things is a great way to maximize short term profits at the expense of the long term. But fuck it, I got mine in the short term, so it works.
Yes, I was, but there was also some initial manufacturing issue with oxidation. That wasn’t the bulk of the issues that they were running into, though.